Understanding advanced packaging trends

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VIDEO

Understanding advanced packaging trends

Video Summary

Cameron McKnight-MacNeil, Technical Fellow, TechInsights, discusses the semiconductor information platform’s Advanced Packaging Outlook Report 2026, highlighting five key expectations: co-packed optics are set to go mainstream, the importance of HBM for AI, the scaling up of panels and glass, 3D thermal challenges and chiplets in the smartphone – an area to watch.

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